1. Quick lookup by process
Enter a process name or an alias to get the substrate, typical thickness, salt-spray reference and inspection method. Try zinc plating, yellow zinc, anodising, AA15, powder coating, Dacromet, electroless nickel, black oxide, QPQ.
2. Common metal finishing processes
3. Pre- and post-treatment (pickling / passivation / phosphating / sealing / baking / hydrogen removal)
Coating defects (blistering, flaking, mottling, skip plating, early white rust) more than 70% come from pre-treatment and rinsing, not from the plating bath itself. Below, the pre-plating and post-plating steps are listed with parameters, control points and inspection methods; your own process card or the supplier's process sheet governs the actual figures.
1) Pre-treatment (before plating)
| Step | Purpose | Typical parameters (reference) | Control points | Inspection |
|---|---|---|---|---|
| Degreasing | Removes grease, fingerprints and polishing compound so the coating can bond | Alkaline cleaning pH 9–12 at 50–70 °C for 5–15 min; electrochemical or ultrasonic cleaning is more thorough | Pre-wipe heavy soil; wash blind holes and welds thoroughly; always rinse twice after alkaline cleaning | Water-break test: after rinsing the water film must stay unbroken for 30 s |
| Pickling | Removes scale, rust and hot-rolling oxide | Hydrochloric acid 10–15% at room temperature; sulphuric 10–15% at 60–70 °C; stainless in a nitric–hydrofluoric mixture | Use an inhibitor against over-pickling, control concentration, temperature and time, and watch high-strength steels and springs for hydrogen embrittlement | No rust or scale visually; use weight-loss or coupon tests on critical parts; hydrogen embrittlement per GB/T 3098.17 or a delayed-fracture test |
| Activation (light pickling) | Removes the thin oxide left by pickling and exposes active metal | 5–10% hydrochloric or sulphuric acid, 10–30 s at room temperature | Get into the plating bath quickly (≤ 2 min) to avoid re-oxidation; do not over-etch | Adhesion test (see the table below) |
| Blasting / shot peening | Mechanical descaling that also roughens the surface for adhesion | Abrasive 46–120 mesh; pressure 0.4–0.7 MPa; to Sa2.5–Sa3 | Nozzle angle 45°–75°; the compressed air must be oil- and water-free; coat or plate within 4 h | Compare with the ISO 8501 reference pictures (Sa2.5/Sa3) or use a roughness gauge (Rz 40–70 μm) |
| Aluminium alkaline etch + desmutting | Removes the natural oxide and extrusion lines for an even matt surface | Etch in NaOH 40–60 g/L at 50–60 °C for 1–3 min; desmut in HNO₃ 300–500 g/L at room temperature for 10–30 s | Rinse thoroughly after etching (keep alkali out of the anodising bath); change the desmut bath often to stop copper plating out | Even colour, no smut, no dark spots |
| Polishing / barrel finishing / vibratory finishing | Lowers roughness for decorative or mirror requirements | Mechanical polishing; barrel with media and soap; vibratory finishing 20–40 min | Avoid overheating and burning; do not round the edges too far | Visual or comparator plates for Ra; gloss meter |
2) Post-treatment (after plating)
| Step | Purpose | Typical parameters (reference) | Control points | Inspection |
|---|---|---|---|---|
| Passivation (after zinc or zinc-nickel) | Forms a conversion film that multiplies the salt-spray life of the zinc by 3–10 and prevents white rust and fingerprints | Trivalent chromium (the mainstream) at pH 1.8–2.5, 25–35 °C for 20–60 s; hexavalent chromium (blue-white or yellow, being phased out); chromium-free passivation | Rinse thoroughly before passivation (carry-over kills the bath), and hold pH and time tightly; test trivalent parts for hexavalent chromium (RoHS) | Even colour; nitric acid spot test (passive film on zinc); salt spray per GB/T 10125; hexavalent chromium by the diphenylcarbazide method of GB/T 26125/IEC 62321 |
| Phosphating | A base for painting (adhesion, rust prevention) or for friction reduction (cold heading, drawing) | Zinc type 40–55 °C for 5–15 min; iron type by spray at room temperature; manganese type (friction) 80–95 °C | Control the total-to-free acidity ratio (TA/FA) and accelerator concentration; rinse and seal after phosphating | Coating weight (gravimetric, GB/T 9792): 1–5 g/m² as a paint base, 5–15 g/m² for friction; copper sulphate spot test ≥ 3 min without discolouration; crystal density under the microscope |
| Sealing (mandatory after anodising) | Blocks the micropores of the oxide film, stops dye bleeding and improves corrosion and stain resistance | Boiling or hot-water sealing at 95–100 °C, about 1 min per μm; nickel-fluoride cold sealing at 25–35 °C, pH 5.5–6.5; nickel-free sealing | The water must be hot enough (<95 °C 封孔不良), 水质要纯(防白霜); 封孔后不可再机加工 | dye spot test per GB/T 8753.2: spots per cm² within limits; admittance test ISO 2931; acid-dissolution weight loss GB/T 8753.1) |
| Colouring / dyeing (after anodising) | Decorative and identification colours | Organic dyes at 50–60 °C for 5–15 min; electrolytic colouring (tin or nickel salts) | The film must be even before dyeing; control colour against a master sample | Colorimeter ΔE; visual comparison with the master; light and wash fastness |
| Baking / curing | Drives off moisture, cures the coating and sinters Dacromet | Powder coating 180–200 °C for 15–20 min; e-coat 170–180 °C for 20–30 min; Dacromet 300 °C for 30 min; drying after passivation 60–80 °C | Measure the part temperature, not the oven dial; watch load size and ramp time — over-baking embrittles, under-baking ruins adhesion | Cross-cut adhesion GB/T 9286 (class 1 or better); pencil hardness GB/T 6739; solvent rub (50 double rubs with MEK); colour and gloss |
| Hydrogen removal (de-embrittlement) | Drives hydrogen out of high-strength steel and springs after plating to prevent delayed fracture | 190–230 °C for 2–4 h (ordinary parts), 4–24 h for high-strength parts, starting within 1–4 h of plating | 温度不可过高(>stay below 250 °C to protect coating and substrate); start the clock when the parts reach temperature | Delayed-fracture test (GB/T 3098.17); hydrogen content; re-check for cracks after 48 h |
| Rinsing (multi-stage counterflow) | Prevents drag-in contamination and keeps the final rinse clean | Three-stage counterflow; pure or deionised water for the last stage | Final rinse conductivity <10μS/cm; 喷嘴通畅, 无死角 | Test the final rinse with a conductivity pen; no water marks or smut visually |
3) Should plating be sealed? Judge by the coating type
One distinction first:sealing after anodising is mandatory (the oxide is porous; unsealed dye bleeds and salt spray fails); sealing after electroplating is an extra post-treatment (the deposit is already dense metal — sealing fills micropores, prevents tarnish and adds a barrier), so whether to do it depends on the coating and the application, it is not automatic.
| Coating | Sealing? | Usual practice | Purpose / cautions |
|---|---|---|---|
| Zinc plating (blue-white / yellow / black) | Yes (passivation is essential, sealing is extra protection) | Passivation (trivalent or chromium-free) is the basic step; add sealing when salt spray must reach 96 h or more Organic or silicate sealer | Fills the pores of the passive film and lifts salt-spray life and white-rust resistance; the colour darkens and contact resistance rises, so be careful with conductive parts |
| Zinc-nickel plating | Yes | Passivation plus sealing (standard for automotive parts) | Salt spray up to 720–1 000 h; rinse thoroughly before sealing or the bath is ruined |
| Electroless nickel (Ni-P, including on aluminium) | Recommended | Passivate, use an anti-tarnish or a dedicated sealer after plating (especially when the deposit <10μm, 铝基体) | Electroless nickel is microporous, so unsealed it pits and tarnishes; note the effect on solderability and contact resistance |
| Nickel plating (decorative or engineering) | Normally not sealed on its own | Use an anti-tarnish where required; in a nickel-plus-chromium system the chromium does the protecting | Plain nickel yellows in hot humid conditions — add anti-tarnish if it matters |
| Decorative / hard chromium | No | Neutralise (alkali) and hot rinse only | The microcracks in chromium self-passivate; the point is to wash out hexavalent chromium residues that later cause rust spots |
| Silver plating | Yes (anti-tarnish) | Passivation, silver anti-tarnish, or thicker protection in sulphur-bearing environments | Silver blackens with sulphur; check contact resistance on contacts and connectors |
| Tin plating | Usually no | Neutralise and anti-tarnish only (dichromate or benzotriazole, with customer approval) | Sealing clearly damages solderability, so electronic parts are not sealed by default |
| Gold / palladium plating | No | — | The noble metals are stable; sealing contaminates the surface and hurts wire bonding and contact resistance |
| Copper plating | Yes (anti-tarnish) | Benzotriazole (BTA) anti-tarnish | Copper oxidises and blackens easily — protect work in process especially |
→ ① yes, or ② yes with ③ no = seal it; ③ yes (especially tin solderability, gold wire bonding, contact resistance) = do not seal— just neutralise and anti-tarnish.
Order matters: high-strength parts (bolts of grade 10.9 and above, springs) must be de-embrittled within 1–4 h of plating before passivation and sealing — passivating first and baking afterwards bakes the passive film away; if you did passivate first, re-passivate after de-embrittlement. A sealed part is normally not machined or bent again.
Points that are easily confused:· Pickling is not passivation — pickling removes scale (and activates the surface, so it rusts again quickly) while passivation forms a protective film; stainless must be passivated after pickling or its corrosion resistance actually drops; · phosphating can be a pre-treatment (paint base) or a final finish (friction reduction, rust prevention), depending on coating weight and whether it is painted; · sealing after anodising is not optional — unsealed dye bleeds and salt spray fails; · do not dry zinc-plated parts above 60–80 °C after passivation, or the film cracks and corrosion resistance falls.
4. Multilayer plating: copper strike, nickel, chromium
Yes — it is the mainstream for decorative and protective plating. Chromium is hardly ever plated straight onto steel: the deposit is highly stressed with a natural microcrack network that runs down to the substrate, so moisture pits it and rust bleeds out. A drawing that says only "chrome plated" is in practice a copper undercoat → nickel → chromium (Cu-Ni-Cr) multilayer system. A decorative chromium callout should spell out the layer structure, e.g. Fe/Cu15/Ni15b/Cr0.3.
1) Why the nickel layer must sit in between
| Layer | Role | Typical thickness | Control points / common problems |
|---|---|---|---|
| Copper | Levels and fills (polishing lines, pits, scratches), cuts cost (copper is cheaper than nickel) and relieves stress, giving the nickel a bright base | Copper strike 3–5 μm; acid copper 10–25 μm | Copper oxidises fast, so do not leave it in air (into the nickel bath within about 10 min) or interlayer adhesion drops; too thin a copper layer will not level, and substrate marks show through the chromium |
| Semi-bright nickel (sulphur < 0.005%) | The corrosion-resistance workhorse: columnar, ductile, and at a different potential from bright nickel so corrosion spreads sideways instead of through | 10–15 μm, 60–70% of the total nickel | Keep 100–150 mV of potential difference from the bright nickel (verify by STEP test); too small a difference is no better than single-layer nickel |
| High-sulphur nickel (triple nickel, 0.1–0.2% sulphur) | A sacrificial layer that keeps corrosion spreading sideways within that thin layer, lifting corrosion resistance another notch | 1–2μm | Too thick it darkens and adhesion to the bright nickel falls; triple nickel is expensive and usually reserved for outdoor high-corrosion parts |
| Bright nickel (0.03–0.08% sulphur) | Brightness, levelling and a carrier for chromium (chromium straight on iron adheres poorly and yellows) | 5–10μm | Additive breakdown causes pitting and cloudiness, so filter continuously through carbon; sitting too long before chromium passivates the nickel and clouds the chromium |
| Chromium | Wear resistance, tarnish resistance, decoration; the microcrack or micropore structure spreads the corrosion current over countless tiny cells | Decorative 0.1–0.5 μm (0.25 usual); hard chromium 10–100 μm | Too thin it clouds and yellows and wears quickly; too thick the cracks deepen and corrosion resistance drops; hexavalent chromium is restricted under RoHS/REACH |
| Electroless nickel (EN) | Throws into recesses better than anything else — a conductive layer on plastics, a base on aluminium and in deep holes, or a wear-resistant functional layer | Conductive layer 0.2–0.5 μm; functional layer 5–25 μm | Plastics must be fully covered; a skip burns and turns into a black spot in the following plating steps |
2) Common multilayer systems, substrate to surface
| System | Layer structure / typical thickness | Typical use | Acceptance focus / standard |
|---|---|---|---|
| Decorative chromium on steel Cu-Ni-Cr | Cu 10–25 + bright Ni 10–20 + Cr 0.1–0.5 | Sanitary ware, furniture, automotive and motorcycle trim, decorative fasteners | GB/T 9797 (Ni+Cr, Cu+Ni+Cr); write the full system on the drawing |
| Double or triple nickel + microporous chromium | Semi-bright Ni 10–15 + (high-sulphur Ni 1–2) + bright Ni 5–10 + microporous Cr 0.1–0.3 | Automotive exterior, outdoor high-corrosion parts | STEP test for interlayer potential; CASS 24–48 h; micropore density ≥ 10⁶ per cm² |
| Copper undercoat + hard chromium (hydraulic rods, rollers) | Cu 5–15 + hard chromium 20–50 | Cylinder rods, piston rods, guide rollers, moulds | GB/T 11379; ground after plating, so the drawing must give the "after plating" size; check adhesion by thermal shock |
| Aluminium parts Double zincate + electroless nickel + Cu + Ni + Cr | Zincate twice + EN 3–5 + Cu 10–20 + Ni 8–12 + Cr 0.2–0.5 | Aluminium handles, trim and bodies | Aluminium cannot be plated directly — zincate or electroless nickel first; measure thickness by XRF |
| Zinc die castings Cu-Ni-Cr | Pyro or cyanide copper 8–15 + acid copper 10–20 + Ni 8–12 + Cr 0.2–0.3 | Handles, locks, lighting, hardware | Die castings are porous and blister readily; check the copper covers completely (no exposure of the zinc substrate) |
| Plating on ABS | EN 0.2–0.5 + pyro copper 20–30 + semi-bright or bright Ni 10–15 + Cr 0.1–0.3 | Automotive grilles, appliance panels, sanitary plastic parts | GB/T 12600; no blistering after thermal cycling (−40 to 80 °C); too thin a copper layer always blisters |
| Electroless nickel base + electroplated nickel build-up | EN 3–5 + electroplated Ni 10–30 | Deep holes, blind holes, complex cavities | Electroless nickel covers the inside, electroplating builds thickness; measure the cavity thickness at its own points |
| Cu / Ni / Au (connectors, PCB) | Cu 15–25 + Ni 1.3–5 + Au 0.05–1.27 | Contacts, gold fingers, lead frames | Nickel is the diffusion barrier that stops copper diffusing into gold and raising contact resistance; measure the layers by XRF |
| Cu / Ni / Sn | Cu base + Ni 1–3 + Sn 3–10 | Terminals, busbars, solderable parts | Solderability (GB/T 2423.32) plus whisker assessment; the nickel blocks copper-tin interdiffusion |
| Cu / Ni / Ag | Cu + Ni 2–5 + Ag 5–20 | Cutlery, conductive parts, high-frequency parts | Silver anti-tarnish; contact resistance; adhesion (silver is soft and scratches easily) |
3) Measuring multilayer thickness (where inspection trips up most)
| Method | Resolves layers? | Notes / standard |
|---|---|---|
| Metallographic cross-section | Yes, the most accurate | Section, mount, polish and etch to reveal the interfaces, then measure each layer under the microscope; always the referee in multilayer disputes (GB/T 6462 / ISO 1463) |
| Coulometric (electrolytic) method | Yes, dissolving layer by layer | The potential jumps as each layer dissolves through, so Cu/Ni/Cr and double nickel can be resolved; destructive, small area (GB/T 4955) |
| XRF (X-ray fluorescence) | Yes, when the layers are thick enough | Reads several layers at once and works well for Cu/Ni/Au; error grows when a layer is under 1 μm or neighbouring lines interfere, so calibrate with standards (GB/T 16921) |
| Magnetic / eddy current | No | They measure total thickness only, and since nickel is both ferromagnetic and conductive neither method is reliable on Cu-Ni-Cr — do not use a gauge reading on a multilayer chromium part to judge a single layer |
Fe/Cu15/Ni15b/Cr0.3 (b = double nickel),Fe/Cu10/Ni20/Cr0.5; for plastics write ABS/EN0.3/Cu25/Ni12/Cr0.25. Submit samples with all three: each layer's thickness, adhesion and salt spray (or CASS) — miss one and you cannot tell a coating fault from a pre-treatment fault.4) Which layer to blame for a defect
| Symptom | Usually traced to |
|---|---|
| Large blisters, sheets of peeling | Incomplete degreasing, or poor copper-to-substrate adhesion (parts left too long after activation) |
| Local pinholes, pits, roughness | Organic contamination or additive breakdown in the nickel bath with poor filtration; insufficient copper levelling |
| Cloudy, hazy or bluish chromium | The nickel passivated before chromium (held too long, poor rinsing), or the chromium bath is too cold or the current density too low |
| Burning and blackening at edges and sharp corners | Current density too high, poor jig contact, no shielding at the edges |
| Skip plating, white spots or round marks in high-current areas | Jig contact in the wrong place (nothing plates under it); put contacts on non-cosmetic faces and add a plating boss |
| Pitting red rust in salt spray (not sheets of it) | Chromium cracks reaching the nickel, nickel too thin, or too little potential difference in double nickel — "chromium too thin" is not the only cause |
| Blistering after thermal cycling (plastics) | Copper too thin to absorb the expansion mismatch, coating stress not relieved, or moulded-in stress not annealed out |
| Flaking or chrome loss on edges after assembly | Poor interlayer adhesion plus brittle chromium; edges carry concentrated current and high stress, so chamfer them or mask them from plating |
5) Three hard rules on sequence
- No pause after copper, no passivation before chromium: oxidised copper and passivated nickel both kill adhesion, so Cu → Ni → Cr must run on a continuous line, into the next tank straight after rinsing.
- Hydrogen embrittlement accumulates: each plating step evolves hydrogen at the cathode, so bolts of grade 10.9 and above, springs and high-strength stampings cannot rely on "we de-embrittled after each step" — they need a single de-embrittlement within 1–4 h of finishing all plating (200–230 °C for 2–4 h, 4–24 h for high-strength parts), with passivation and sealing afterwards.
- Design jigs and masking up front: multilayer parts always skip at the jig contact, so fix the contact points at the design stage (non-cosmetic, non-mating faces) and plug or tape threaded and precision fits — do not wait until after plating to rework.
5. Choosing a thickness gauge: magnetic vs eddy current vs XRF
| Method | Principle | Applies to (substrate → coating) | Standard |
|---|---|---|---|
| Magnetic method (magnetic induction or pull-off) | The magnetic circuit changes with coating thickness | Ferromagnetic substrate (carbon steel, iron, alloy steel) with a non-magnetic coating: zinc, nickel, tin, powder coat, paint, e-coat, phosphate, black oxide | GB/T 4956 ISO 2178 |
| Eddy current | High-frequency eddy currents change with coating thickness | Non-magnetic metal substrate (aluminium and its alloys, copper, zinc die castings, 304/316 austenitic stainless) with a non-conductive coating: anodic film, powder coat, paint, e-coat, powder coating | GB/T 4957 ISO 2360 |
| X-ray fluorescence (XRF) | Characteristic fluorescence of the coating | Metal coatings on metal: zinc (blue-white or yellow passivate), nickel, electroless nickel, tin, zinc-nickel, gold and silver — measures several layers and alloy composition at once | GB/T 16921 ISO 3497 |
| Coulometric (electrolytic) method | Coulometric dissolution | Metal coatings (multilayer capable); destructive, used as the referee | GB/T 4955 |
| Metallography (cross-section) | Measured on a magnified section | Any coating or anodic film; destructive; the referee method | GB/T 6462 ISO 1463 |
| Split-beam microscope | Groove and microscope | Anodic film on aluminium (after sealing) | ISO 2128 |
6. Where an eddy-current gauge applies
- Suitable for: non-conductive coatings on non-conductive coating——
- anodic films on aluminium and its alloys (the AA10/AA15/AA20 acceptance checks on this site's aluminium extrusions use an eddy-current gauge);
- powder coat, paint, e-coat and other organic coatings on aluminium, copper, zinc die castings and stainless.
- Not suitable for:
- any coating on a ferrous (magnetic) substrate — eddy-current readings on steel are unreliable, use Magnetic method (zinc or powder coat on steel is magnetic only);
- metallic conductive coatings on a non-magnetic substrate (electroless nickel on aluminium, nickel on copper, zinc itself) — coating and substrate both conduct and the eddy-current signal blurs, so use XRF or metallography.
- Substrate check:304/316 austenitic stainless is weakly magnetic (more so after cold work) and should be measured in eddy-current mode as a non-magnetic substrate; if the gauge auto-detects Fe, switch to NFe and check again.
- Operating points: calibrate with the supplied standards each shift; keep test points 10 mm from edges and 10 mm apart and take 3–5 per part; a ferrous table or fixture behind the part biases magnetic readings, so isolate it.
- Acceptance criteria: anodic film on aluminium is graded by GB/T 8013.1 (AA5/AA10/AA15/AA20/AA25 correspond to mean thicknesses of 5/10/15/20/25 μm); powder coat and paint are usually 60–120 μm per the drawing; zinc plating per GB/T 5267.1 / ISO 4042 (e.g. Fe/Zn 5, Fe/Zn 8, Fe/Zn 12).
7. Inspection items and methods
| Item | Method / instrument | Standard | Applies to |
|---|---|---|---|
| Appearance (colour, bare spots, burning, burrs, runs) | Visual plus a 6–10× magnifier; colour by colorimeter (ΔE usually ≤ 1.0–1.5) | per drawing / GB/T 3181 (colour chips) | All |
| Thickness | Magnetic / eddy current / XRF (see section 5); metallography for arbitration | GB/T 4956, GB/T 4957, GB/T 16921, GB/T 6462 | All |
| Adhesion | Cross-cut with tape pull-off; coatings can use thermal shock, file or bend tests | GB/T 9286 (coatings), GB/T 5270 (platings) | Powder coat, paint, e-coat, platings |
| Corrosion resistance | Neutral salt spray (time to white rust or red rust); CASS as an accelerator for passivated zinc | GB/T 10125 / ISO 9227 | Zinc, zinc-nickel, Dacromet, electroless nickel, coatings |
| Coating hardness | Microhardness tester (HV0.1/HV0.3) | GB/T 4340.1 | Hard chromium, electroless nickel, QPQ, nitriding |
| Coating hardness | Pencil hardness (usually ≥ H/2H) | GB/T 6739 | Powder coat, paint |
| Impact resistance | Impact test (50 kg·cm without cracking is usual) | GB/T 1732 | Powder coat, paint |
| Seal quality of anodic film | Dye stain spot test; phosphoric-chromic acid weight loss | GB/T 8753 series | anodising |
| hydrogen embrittlement | Delayed-failure or dedicated hydrogen embrittlement testing; for high-strength parts prefer Dacromet or zinc-nickel, which are hydrogen-free processes | GB/T 3098 series, ISO 4042 | Electroplated bolts of grade 10.9 and above, spring parts |
| Coating composition (alloy ratio) | XRF (zinc-nickel at 12–15% Ni, phosphorus in electroless nickel) | GB/T 16921 | Zinc-nickel, electroless nickel |
8. Salt-spray reference by coating (neutral salt spray)
9. Pre-plating allowance for precision holes and shafts
Basic formula (t = coating thickness per side):
· Shaft (outside diameter): grows after plating → pre-plating diameter = finished diameter − 2t (allow towards the low limit)
· Hole (bore): shrinks after plating → pre-plating diameter = finished diameter + 2t (allow towards the high limit)
Acceptance basis: thickness is accepted on the minimum (μmin) while real coatings run 20–50% heavy, so calculate the allowance on the upper thickness limit— otherwise being out of tolerance after plating is the likely outcome.
| Process | Typical t per side | Total diameter allowance 2t | Practical notes |
|---|---|---|---|
| Zinc plating (blue-white / yellow / black) | 5–12 μm | 10–24 μm | Normally plated to size and not machined afterwards. Fasteners follow GB/T 5267.1; for threads see the 4t rule below. |
| Nickel plating | 8–20 μm | 16–40 μm | Throw is only fair (current density varies, edges run thick), so avoid it on precision fits; electroless nickel is better. |
| Electroless nickel | 10–50 μm | 20–100 μm | Uniform to ±1–2 μm —first choice for precision holes and shafts; no machining afterwards, and it plates inside holes. |
| Decorative Cr (Cu-Ni-Cr) | 15–30 μm total | 30–60 μm | Mainly cosmetic; where a mating face needs precision, allow the full thickness or plug it and leave it unplated. |
| Hard chromium | 20–50 μm | 40–100 μm | Usual route: grind to the pre-plating size → hard chrome (about 0.05 oversize) → finish grind after plating. Pre-plating size = finished − 2t. |
| Anodising (aluminium) | Film 10–25 μm | ≈ 10–25 μm | Half the film grows into the metal: an outside diameter grows by about t and a bore shrinks by about t. Precision bores in aluminium must be opened up or honed after anodising. |
| Hard anodising | Film 25–80 μm | ≈ 25–80 μm | As above, and the hard film is brittle with chipping edges; for IT7 or better on mating faces, grind or hone after anodising. |
| Dacromet / zinc-aluminium coating | 6–12 μm | 12–24 μm | Thin and hydrogen-free, so threaded parts usually need no allowance; high-strength bolts are certified to 5267. |
| Black oxide / phosphating | 1–5 μm | 2–10 μm | Normally no allowance, but on precision sliding fits (a spool valve, for instance) the film is thick enough to change the clearance — verify it. |
| Nitriding (not a coating) | Case 0.3–0.6 mm | OD grows 0.01–0.05 | Distortion dominates: leave grinding or honing stock after nitriding, no more than 0.05 per side — grind more and you remove the strongest part of the case. |
| Carburize and harden | Case 0.5–1.5 mm | Grinding stock 0.4–0.6 (diameter) | Distortion plus surface oxidation and decarburisation: leave 0.4–0.6 on diameter for finish grinding; bores shrink during hardening, so bore them to the high limit before carburising. |
| Hot-dip galvanizing | 70–100 μm | 140–200 μm | Thick and uneven, not for precision parts; bolt threads are re-chased after coating (tapped oversize) and internal threads cleaned out. |
The 4t rule for threads: coating builds on both flanks of the 60° form, so the pitch diameter grows by about four times the thickness per side (4t). The M10 6g pitch diameter tolerance is about 0.15 mm; 8 μm of zinc adds 32 μm (about a fifth), which normally still assembles. At 10 μm or more, or where interchangeability is required, machine the pitch diameter undersize before plating or use a looser class (6e).
Three hard rules:
1. The drawing must state the measuring basis: "φ40h7 + 10 μm nickel" without saying before or after plating always ends in an argument. Write instead:"φ40 h7 (measured after plating)" or "pre-plating φ39.97 ± 0.01, 10 μm Ni, finished φ40 h7".
2. Do not plate interference or transition fits: thickness variation eats the interference. Plug or mask with peelable lacquer, or brush plate and finish grind.
3. Deep holes and internal corners do not plate: plating follows current distribution, so deep cavities and bores run thin or skip; where the inside must be uniform, switch to electroless nickel.
Pre-plating size calculator: enter the finished diameter and the thickness per side to get the pre-plating target.